Cross-linking processes in antimicrobial UV-sol-gel systems initiated by atmospheric pressure plasma

Sol-gel systems are becoming increasingly popular in the coating industry. However, current coatings are only a few 100 nanometers thick. Due to high stress, e.g., in the aerospace industry, such coatings wear out too quickly and lose their protective effect. Using an atmospheric pressure plasma source, we can cure thicker sol-gel layers both completely and faster and functionalize the coating in a single step. In this contribution, we treat sol-gel layers to make them scratch-resistant, anti-adhesive, and antimicrobial by adding Cu particles. Fourier transform infrared spectroscopy can determine the degree of curing. Additionally, transient thermal finite element calculations were performed to optimize plasma curing parameters and prevent local thermal damage to the sol-gel system and the substrate material. This combination of simulation and experiments allowed a quick determination and solution of the treatment shortcomings.